AT&S is the European market leader and one of the globally leading manufacturers of high-end IC Substrates and high-value printed circuit boards. AT&S industrializes leading-edge technologies for its core business segments as Mobile Devices, Automotive, Industrial, Medical and Advanced IC Packaging.

奥地利科技与系统技术股份公司（AT&S）简称奥特斯，是欧洲以及全球领先的高端半导体封装载板和高密度互连印制电路板制造商。集团致力于生产具有前瞻性技术的产品，并将工业领域的核心市场定位于：移动设备、汽车和航天、工业电子、医疗与健康以及先进半导体封装领域。

As a fast growing multinational company, AT&S currently has six production bases in Austria and Asia – Austria: Leoben (Headquarter) and Fehring; Asia: Nanjangud of India, Ansan of Korea, Shanghai and Chongqing of China.

作为一家迅速发展的跨国企业，奥特斯目前在奥地利本土和亚洲地区共拥有六个生产基地 - 奥地利：利奥本、菲岭；亚洲：印度南燕古德、韩国安山、中国上海和重庆。

Established in 2011, AT&S Chongqing is located in Chongqing Liangjiang New Area Yufu Industrial Park, and this is the second sole proprietorship enterprise of AT&S Group established in China. AT&S is currently investing in two cutting-edge technologies in Chongqing, and started mass production in Apr. 2016. AT&S Chongqing produces the latest generation of high-end IC Substrates for the use in computer microprocessor, and HDI PCB for the use in mobile devices, wearable devices and high-end internet products. AT&S Chongqing has become the first high-end IC Substrates manufacturer in China.

奥特斯科技（重庆）有限公司建立于2011年，是奥特斯集团在中国设立的第二家独资企业（工厂位于重庆市两江新区鱼复工业园区）。奥特斯目前在中国重庆工厂投资两大尖端技术，于2016年4月投产,生产全球领先的半导体封装载板和系统级封装印制电路板，产品应用于电脑微处理器、移动设备、可穿戴设备和高端物联网产品。奥特斯已成为中国唯一的新一代高端半导体封装载板制造商。

To meet the increasing demand of digitalization, artificial intelligence, robotics and autonomous driving, ever faster processing of huge volumes of data, and based on the close cooperation with the world-leading semiconductor manufacturer, in Jul. 2019, AT&S announced to invest nearly one billion Euro for the next five years to build a new plant in Chongqing, which introduces the most advanced technology and equipment to produce new high-end IC Substrates.

基于数字化、人工智能、机器人和自动驾驶蓬勃发展，市场对于高速数据处理能力的需求日益强劲，以及奥特斯与全球领先的集成电路制造商的紧密合作，2019年7月奥特斯集团宣布计划在未来五年投资近10亿欧元建设奥特斯重庆三期项目，引进最先进的技术和设备生产新一代的半导体封装载板。